Image sensor and method for manufacturing the same

ABSTRACT

Disclosed are an image sensor and a method for manufacturing the same. The image sensor includes a substrate provided with a transistor circuit, first and second interconnections separated from each other on the substrate, a first conductive-type conductive layer formed at side surfaces of the first interconnection, a second conductive-type conductive layer formed at side surfaces of the second interconnection, and an intrinsic layer formed between the first and second conductive-type conductive layers thereby forming a P-I-N structure.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. application Ser. No.11/842,840, filed Aug. 21, 2007, now U.S. Pat. No. 7,585,696, whichclaims the benefit of Korean Patent Application No. 10-2007-0023307,filed Mar. 9, 2007, which are incorporated herein by reference in theirentirety.

BACKGROUND

An image sensor is a semiconductor device for converting optical imagesinto electric signals, and is mainly classified as a charge coupleddevice (CCD) image sensor or a complementary metal-oxide semiconductor(CMOS) image sensor.

The CMOS image sensor includes a photodiode and a MOS transistor in eachunit pixel, and sequentially detects the electric signals of each unitpixel in a switching mode to realize images.

A CMOS image sensor according to the related art includes a photodiodearea for receiving an optical signal and converting the optical signalinto an electrical signal, and a transistor area for processing theelectrical signal.

However, in the CMOS image sensor according to the related art,photodiodes and transistors are horizontally disposed, and thephotodiodes are positioned on the same plane as that of a transistorcircuitry.

Although the CMOS image sensor according to the related art overcomesthe disadvantages of the CCD image sensor, problems still remain in theCMOS image sensor.

In other words, in the CMOS image sensor according to the related art,the photodiodes and the transistors are positioned on a substrate suchthat they are horizontally adjacent to each other. Accordingly,additional areas are required for the photodiodes. For this reason, afill factor area may be reduced, and resolution may be restricted.

Further, the CMOS image sensor according to the related art hasdifficulties in optimizing the manufacturing process when thephotodiodes and the transistors are simultaneously manufactured. Inother words, although a rapid transistor manufacturing process requiresa shallow junction in order to achieve low sheet resistance, the shallowjunction is unstable for the photodiode manufacturing process.

In addition, in the CMOS image sensor according to the related art,since additional on-chip functions are provided in the CMOS imagesensor, the size of a unit pixel must increase in order to maintain thesensitivity of the image sensor, or the area for the photodiode mustdecrease in order to maintain the size of a pixel. However, if the sizeof a pixel increases, the resolution of the CMOS image sensor maydecrease, and if the area for the photodiode decreases, the sensitivityof the image sensor may decrease.

BRIEF SUMMARY

Accordingly, embodiments of the present invention provide an imagesensor and a method of manufacturing the same, capable of providing anew scheme of integrating a transistor circuitry and a photodiode.

An image sensor and a method of manufacturing the same, capable ofimproving resolution and sensitivity, can be provided.

In addition, according to embodiments, an image sensor and a method ofmanufacturing the same, in which a photodiode is formed at the upperportion of a transistor circuitry, thereby ensuring an insulatingproperty between unit pixels of photodiodes, can be provided.

According to one embodiment, there is provided an image sensor includinga substrate provided with a transistor circuit and at least two lowerinterconnections, a first upper interconnection electrically connectedto a first lower interconnection of the at least two lowerinterconnections, a second upper interconnection electrically connectedto a second lower interconnection of the at least two lowerinterconnections, a first conductive-type conductive layer formed on atleast one sidewall surface of the first upper interconnection, a secondconductive-type conductive layer formed on at least one sidewall surfaceof the second interconnection, and an intrinsic layer formed between thefirst and second conductive-type conductive layers. The firstconductive-type conductive layer, the intrinsic layer, and the secondconductive-type conductive layer provide a diode structure that ishorizontally arranged.

According to an embodiment, a method of manufacturing an image sensorincludes forming a transistor circuit and at least two lowerinterconnections on a substrate, forming a first upper interconnectionon a first lower interconnection of the at least two lowerinterconnections, forming a first conductive-type conductive layer on atleast one sidewall surface of the first upper interconnection, formingan intrinsic layer on the substrate including the first conductive-typeconductive layer and the first upper interconnection, forming a trenchin the intrinsic layer corresponding to a second lower interconnectionof the at least two lower interconnections, forming a secondconductive-type conductive layer on at least one sidewall surface of thetrench, and forming a second upper interconnection in the trench havingthe second conductive-type conductive layer.

According to another embodiment, a method of manufacturing an imagesensor includes forming a transistor circuit including lowerinterconnections on a substrate, forming first and secondinterconnections corresponding to the lower interconnections on thesubstrate, forming a first conductive-type conductive layer at sidesurfaces of the first interconnection, forming a second conductive-typeconductive layer at side surfaces of the second interconnection, andforming an intrinsic layer on the substrate including the first andsecond conductive-type conductive layers.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a cross-sectional view of an image sensor according to anembodiment of the present invention;

FIGS. 2 to 6 are cross-sectional views showing the procedure ofmanufacturing an image sensor according to an embodiment of the presentinvention; and

FIGS. 7 to 11 are cross-sectional views showing the procedure ofmanufacturing an image sensor according to another embodiment of thepresent invention.

DETAILED DESCRIPTION

Hereinafter, an image sensor and a method of manufacturing the sameaccording to embodiments of the present invention will be described withreference to the accompanying drawings.

In the following description, the expression “formed on/under eachlayer” may include the meaning of both “formed directly on/under eachlayer” and “formed indirectly on/under each layer.”

FIG. 1 is a cross-sectional view showing an image sensor according to anembodiment.

Referring to FIG. 1, an image sensor, according to an embodiment,includes first and second interconnections 140 and 145, which areseparated from each other on a substrate, a first conductive-typeconductive layer 150 formed at side surfaces of the firstinterconnection 140, a second conductive-type conductive layer 180formed at side surfaces of the second interconnection 145, and anintrinsic layer 170 formed between the first and second conductive-typeconductive layers 150 and 180.

The first and second interconnections 140 and 145 can be formedcorresponding to lower interconnections 120 formed in an interlayerdielectric layer (ILD) 110.

The first conductive-type conductive layer 150 can be formed at one sidesurface or two or more side surfaces of the first interconnection 140.When the first conductive-type conductive layer 150 is formed at two ormore sides of the first interconnection 140, the first interconnection140 can serve as a common interconnection or node.

The second conductive-type conductive layer 180 can be formed at oneside surface or two or more side surfaces of the second interconnection145. When the second conductive-type conductive layer 180 is formed attwo or more side surfaces of the second interconnection 145, the secondinterconnection 145 can serve as a common interconnection or node.

In the image sensor according to these embodiments, the photodiode ispositioned above transistor circuitry, so that a fill factor canapproach 100%, and a higher sensitivity can be achieved relative to thesame pixel size as compared with the related art.

Further, according to an embodiment, manufacturing costs can be reducedin order to achieve the same resolution as that of the related art, andeach unit pixel can be realized utilizing more complicated circuitrywithout the decrease of sensitivity.

In addition, additional on-chip circuitry can be included to improve theperformance of the image sensor, minimize the size of the device, andreduce the manufacturing costs for the device.

Further, according to embodiments of the present invention, thephotodiode is formed above the transistor circuitry, and an insulatingproperty between unit pixels of photodiodes can be ensured to isolateand reduce cross-talk between unit pixels.

Hereinafter, details of a method of manufacturing an image sensoraccording to an embodiment of the present invention will be describedwith reference to FIGS. 2 to 6.

Referring to FIG. 2, CMOS circuitry (not shown) including lowerinterconnections 120 can be formed on a substrate.

In one embodiment, a barrier metal (not shown) can be formed on aninterlayer dielectric layer (ILD) 110, including the lowerinterconnections 120. The barrier metal can be, for example, tungsten,titanium, tantalum, tungsten nitride, titanium nitride, or tantalumnitride. In an alternative embodiment, the barrier metal may not beformed.

Thereafter, a first interconnection 140 can be formed on a lowerinterconnection 120. The first interconnection 140 can be electricallyconnected to one of the lower interconnections 120.

The first interconnection 140 can be formed of conductive materials suchas metal, alloy, and silicide. For example, the first interconnection140 can include aluminum, copper, or cobalt.

Referring again to FIG. 2, a first conductive-type conductive layer 150can be formed on the entire surface of the substrate including the firstinterconnection 140.

The first conductive-type conductive layer 150 can serve as an “N” layerof a PIN diode. Although the first conductive-type conductive layer 150is described as an N-type conductive-type conductive layer, embodimentsare not limited thereto.

According to one embodiment, the first conductive-type conductive layer150 includes N-doped amorphous silicon, but embodiments are not limitedthereto.

In other words, the first conductive-type conductive layer 150 can beformed of, for example, a-Si:H, a-SiGe:H, a-SiC:H, a-SiN:H, or a-SiO:Hobtained by doping amorphous silicon with germanium, carbon, nitrogen,or oxygen (amorphous silicon being denoted as a-Si).

The first conductive-type conductive layer 150 can be formed through achemical vapor deposition (CVD) process, such as a plasma enhancedchemical vapor deposition (PECVD) process. In an embodiment the firstconductive-type conductive layer 150 can be formed using amorphoussilicon through a PECVD process by applying a mixture of silane gas(SiH₄), PH₃, and P₂H₅.

Then, referring to FIG. 3, an etch-back process can be performed withrespect to the first conductive-type conductive layer 150 to form thefirst conductive-type conductive layer at both sides of the firstinterconnection 140.

Thereafter, referring to FIG. 4, an intrinsic layer 170 can be formed onthe substrate including the first conductive-type conductive layer 150,and a trench 172 can be formed therein.

At this time, the intrinsic layer 170 can serve as an “I” layer of thePIN diode according to an embodiment.

The intrinsic layer 170 can be formed by using amorphous silicon. Theintrinsic layer 170 can be formed through a CVD process, such as a PECVDprocess. For example, the intrinsic layer 170 can be formed usingamorphous silicon through the PECVD process by applying silane gas SiH₄.

After forming the intrinsic layer 170, a trench 172 can be formed at aposition for the second interconnection 145. The second interconnection145 can be formed corresponding to a lower interconnection 120.

Referring to FIG. 5, a second conductive-type conductive layer 180 canbe formed on the entire surface of the substrate including at sidesurfaces of the trench 172 of the intrinsic layer 170.

The second conductive-type conductive layer 180 can serve as a “P” layerof the PIN diode according to an embodiment. Although the secondconductive-type conductive layer 180 is described as a P-typeconductive-type conductive layer, embodiments are not limited thereto.

The second conductive-type conductive layer 180 can be formed through aCVD process, such as a PECVD process. For example, the secondconductive-type conductive layer 180 can be formed using amorphoussilicon through a PECVD process by applying a mixture of silane gas SiH₄and boron.

Then, referring to FIG. 6, in one embodiment the substrate formed withthe second conductive-type conductive layer 180 can be planarized suchthat the first interconnection 140 is exposed. The substrate can beplanarized, for example, through a chemical mechanical polishing (CMP)process. The portion of the second conductive-type conductive layer 180formed at the bottom surface of the trench 172 is also removed. Thisportion can be removed by performing an etching process. In anembodiment, the second conductive-type conductive layer 180 can beremoved from the surface of the substrate including the intrinsic layer170 and the bottom surface of the trench 172 through an etch backprocess. In another embodiment a portion of the second conductive-typeconductive layer 180 formed on one of the sidewalls of the trench 172can also be removed.

After removing the second conductive-type conductive layer 180 such thatthe second conductive-type conductive layer 180 only remains on thesidewall(s) of the trench 172, a second interconnection 145 can beformed in the trench 172. The second interconnection 145 can be formedof the same materials as the first interconnection 140.

Accordingly, a photodiode is formed above the transistor circuitry, andisolation and reduction of cross-talk between unit pixels of photodiodescan be ensured.

Furthermore, since the photodiode is formed above the transistorcircuitry and has a horizontal structure, the process for an upperinterconnection such as a transparent electrode can be omitted.Accordingly, the image sensor according to the above describedembodiments can be manufactured through a typical semiconductormanufacturing process without additional equipment used for fabricatingthe transparent electrode.

FIGS. 7 to 11 are cross-sectional views showing a method ofmanufacturing an image sensor according to another embodiment.

Different from the embodiments describe with respect to FIGS. 2 to 6,the embodiments described with respect to FIGS. 7 to 11 arecharacterized in that an etching process with respect to the intrinsiclayer 170 is reduced, thereby inhibiting the occurrence of defects inthe photo diode.

Referring to FIG. 7, CMOS circuitry (not shown) including lowerinterconnections 120 can be formed on a substrate.

Then, first and second interconnections 140 and 145 corresponding to thelower interconnections 120 can be formed on the substrate.

Thereafter, referring to FIG. 8, a first conductive-type conductivelayer 150 is formed at side surfaces of the first interconnection 140.

In order to perform the above mentioned process, a first photoresistpattern 152 can be formed covering the second interconnection 145 andexposing the first interconnection 140.

Then, the first conductive-type conductive layer 150 can be formed onthe exposed first interconnection 140.

Thereafter, an etch-back process can be performed with respect to thefirst conductive-type conductive layer 150, so that the firstconductive-type conductive layer 150 remains at sidewalls of the firstinterconnection 140. Then, the first photoresist pattern 152 can beremoved.

Next, referring to FIG. 9, the second conductive-type conductive layer180 is formed at side surfaces of the second interconnection 145.

In order to perform the above mentioned process, a second photoresistpattern 154 can be formed covering the first interconnection 140 andexposing the second interconnection 145.

Thereafter, a second conductive-type conductive layer 180 can be formedon the exposed second interconnection 145.

Then, referring to FIG. 10, an etch-back process can be performed withrespect to the second conductive-type conductive layer 180 such that thesecond conductive-type conductive layer 180 remains at sidewalls of thesecond interconnection 145. Thereafter, the second photoresist pattern154 is removed.

Next, referring to FIG. 11, an intrinsic layer 170 can be formed on thesubstrate including the first conductive-type conductive layer 150 andthe second conductive-type conductive layer 180. The intrinsic layer 170can be deposited to fill the space between the first conductive-typeconductive layer 150 and the second conductive-type conductive layer180. Then, in one embodiment, the substrate can be planarized until thefirst and second interconnection 140 and 145 are exposed.

Accordingly, an etching process for the intrinsic layer 170 isminimized, thereby inhibiting the defects from occurring in thephotodiode.

In the image sensor and the method of manufacturing the same accordingto embodiments of the present invention, the photodiode can bepositioned above the transistor circuitry.

According to the embodiments, a fill factor can approach 100%.

In addition, sensitivity higher than that of the related art can beprovided relative to the same pixel size.

According to certain embodiments, manufacturing costs can be reduced inorder to realize the same resolution as that of the related art.

According to an embodiment, each unit pixel can be realized as a morecomplicated circuitry without reducing sensitivity.

Further, additional on-chip circuitry integrated according to anembodiment can improve the performance of the image sensor, minimize thesize of a device, and reduce the manufacturing costs for the device.

In addition, the photodiode is formed above the transistor circuitry, sothat isolation and reduction of cross-talk between unit pixels ofphotodiodes can be ensured.

In further embodiments, a color filter array can be arranged on thephotodiodes.

Any reference in this specification to “one embodiment,” “anembodiment,” “example embodiment,” etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the invention. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to effect such feature, structure, orcharacteristic in connection with other ones of the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

1. An image sensor, comprising: a substrate provided with a transistorcircuit and at least two lower interconnections; a first upperinterconnection electrically connected to a first lower interconnectionof the at least two lower interconnections; a second upperinterconnection electrically connected to a second lower interconnectionof the at least two lower interconnection; a first conductive-typeconductive layer formed on at least one sidewall surface of the firstupper interconnection; a second conductive-type conductive layer formedon at least one sidewall surface of the second upper interconnection;and an intrinsic layer formed between the first and secondconductive-type conductive layers, wherein the first conductive-typeconductive layer, the intrinsic layer, and the second conductive-typeconductive layer provide a diode structure horizontally arranged.
 2. Theimage sensor according to claim 1, wherein the first conductive-typeconductive layer is formed at one sidewall surface of the first upperinterconnection.
 3. The image sensor according to claim 1, wherein thefirst conductive-type conductive layer is formed on at least twosidewall surfaces of the first upper interconnection.
 4. The imagesensor according to claim 3, wherein the first upper interconnectionserves as a common node for more than one diode.
 5. The image sensoraccording to claim 1, wherein the second conductive-type conductivelayer is formed at one sidewall surface of the second upperinterconnection.
 6. The image sensor according to claim 1, wherein thesecond conductive-type conductive layer is formed on at least twosidewall surfaces of the second upper interconnection.
 7. The imagesensor according to claim 6, wherein the second upper interconnectionserves as a common node for more than one diode.